FAN1084

PRODUCT SPECIFICATION

8

REV. 1.0.8 11/10/03

Junction-to-case thermal resistance is specified from the IC

junction to the bottom of the case directly below the die. This

is the lowest resistance path for heat flow. Proper mounting

ensures the best thermal flow from this area of the package to

the heat sink. Use of a thermally conductive material at the

case-to-heat sink interface is recommended. Use a thermally

conductive spacer if the case of the device must be electri-

cally isolated and include its contribution to the total thermal

resistance. The cases of the FAN1084 series are directly con-

nected to the output of the device.

Figure 6. Application Circuit

Table 1. Bill of Materials for Application Circuit for the FAN1084

Figure 7. Application Circuit (FAN1084-1.5)

Table 2. Bill of Materials for Application Circuit for the FAN1084-1.5

Item

Quantity

Manufacturer

Part Number

Description

C1

1

Xicon

L10V10

10µF, 10V Aluminum

C2, C3

2

Xicon

L10V100

100µF, 10V Aluminum

R1, R2

2

Generic

124

Ω, 1%

U1

1

Fairchild

FAN1084T

4.5A Regulator

Item

Quantity

Manufacturer

Part Number

Description

C1

1

Xicon

L10V10

10µF, 10V Aluminum

C3

1

Xicon

L10V100

100µF, 10V Aluminum

U1

1

Fairchild

FAN1084T-1.5

4.5A Regulator

FAN1084

ADJ

C3

100

µF

C2

100

µF

2.5V

+

C1

10

µF

+

+

IN

OUT

U1

R1

124

Ω

R2

124

Ω

RC1084-1.5

U1

GND

C3

100

µF

+

C1

10

µF

+

IN

OUT