AD830

Rev. C | Page 7 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

±18 V

Internal Power Dissipation

Observe derating

curves

Output Short-Circuit Duration

Observe derating

curves

Common-Mode Input Voltage

Differential Input Voltage

Storage Temperature Range (Q)

−65°C to +150°C

Storage Temperature Range (N)

−65°C to +125°C

Storage Temperature Range (RN)

−65°C to +125°C

Operating Temperature Range

AD830J

0°C to +70°C

AD830A

−40°C to +85°C

AD830S

−55°C to +125°C

Lead Temperature Range (Soldering 60 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD830 is limited by the associated rise in junction temperature.

For the plastic packages, the maximum safe junction

temperature is 145°C. For the CERDIP, the maximum junction

temperature is 175°C. If these maximums are exceeded

momentarily, proper circuit operation will be restored as soon

as the die temperature is reduced. Leaving the AD830 in the

overheated condition for an extended period can result in

permanent damage to the device. To ensure proper operation, it

is important to observe the recommended derating curves.

While the AD830 output is internally short-circuit protected,

this may not be sufficient to guarantee that the maximum

junction temperature is not exceeded under all conditions. If

the output is shorted to a supply rail for an extended period,

then the amplifier may be permanently destroyed.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

28-Lead PDIP Package

90

°C/W

8-Lead SOIC Package

155

°C/W

8-Lead CERDIP Package

11

°C/W

ESD CAUTION

2.5

0

90

1.5

0.5

–30

1.0

–50

2.0

70

50

30

10

–10

AMBIENT TEMPERATURE (°C)

8-LEAD PDIP

8-LEAD SOIC

2.8

0.2

140

0.8

0.4

–40

0.6

–60

1.4

1.0

1.2

1.6

2.0

2.2

2.6

2.4

1.8

100

120

80

60

40

20

0

–20

AMBIENT TEMPERATURE (°C)

8-LEAD CERDIP

Figure 4. Maximum Power Dissipation vs. Temperature, PDIP and SOIC Packages

Figure 5. Maximum Power Dissipation vs. Temperature, CERDIP Package