ADP1753-EVALZ datasheet(5/20 Pages) AD

Numer części	ADP1753-EVALZ

Szczegółowy opis	0.8 A, Low VIN, Low Dropout Linear Regulator

Download	20 Pages

Scroll/Zoom	100%

Producent	AD [Analog Devices]

Strona internetowa	http://www.analog.com

Logo

5 / 20 page

Data Sheet

ADP1752/ADP1753

Rev. E | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +4.0 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to VIN

SS to GND

−0.3 V to VIN

PG to GND

−0.3 V to +4.0 V

SENSE/ADJ to GND

−0.3 V to VIN

Storage Temperature Range

−65°C to +150°C

Junction Temperature Range

−40°C to +125°C

Junction Temperature

150°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP1752/ADP1753 may be damaged if the

junction temperature limits are exceeded. Monitoring ambient

temperature does not guarantee that TJ is within the specified

temperature limits. In applications with high power dissipation

and poor thermal resistance, the maximum ambient tempera-

ture may need to be derated. In applications with moderate

power dissipation and low PCB thermal resistance, the maximum

ambient temperature can exceed the maximum limit as long as

the junction temperature is within specification limits. The

junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA). TJ is calculated using the following formula:

TJ = TA + (PD × θJA).

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending

on PCB material, layout, and environmental conditions. The

specified values of θJA are based on a 4-layer, 4 in × 3 in circuit

board. Refer to JEDEC JESD51-7 for detailed information about

board construction. For more information, see the AN-772

Application Note, A Design and Manufacturing Guide for the

Lead Frame Chip Scale Package (LFCSP) at www.analog.com.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12 document,

Guidelines for Reporting and Using Electronic Package Thermal

Information, states that thermal characterization parameters are

not the same as thermal resistances. ΨJB measures the component

power flowing through multiple thermal paths rather than

through a single path as in thermal resistance, θJB. Therefore,

ΨJB thermal paths include convection from the top of the package

as well as radiation from the package, factors that make ΨJB more

useful in real-world applications. Maximum junction temperature

(TJ) is calculated from the board temperature (TB) and the power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

Refer to the JEDEC JESD51-8 and JESD51-12 documents for more

detailed information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

16-Lead LFCSP with Exposed Pad (CP-16-4)

42

25.5

°C/W

ESD CAUTION

Podobny numer części - ADP1753-EVALZ

Producent	Numer części	Arkusz danych	Szczegółowy opis
Analog Devices	ADP1753	883Kb / 19P	CMOS Linear Regulator
	ADP1753	1,007Kb / 19P	CMOS Linear Regulator
	ADP1753	935Kb / 19P	CMOS Linear Regulator
	ADP1753	777Kb / 20P	4 A, Low VIN, Low Noise, CMOS Linear Regulator Rev. A
	ADP1753	782Kb / 20P	5 A, Low VIN, Low Noise, CMOS Linear Regulator Rev. A

More results

Podobny opis - ADP1753-EVALZ

Producent	Numer części	Arkusz danych	Szczegółowy opis
Analog Devices	ADP1754	738Kb / 20P	1.2 A, Low VIN, Low Dropout Linear Regulator Rev. E
	ADP1755ACPZ	709Kb / 20P	1.2 A, Low VIN, Low Dropout Linear Regulator Rev. F
	ADP1740	743Kb / 20P	2 A, Low VIN, Low Dropout Linear Regulator Rev. E
SHANGHAI BELLING CO., L...	BL8074	1,008Kb / 5P	800mA Ultra-Low Vin Low Dropout Voltage Linear Regulator
ACE Technology Co., LTD...	ACE518C	407Kb / 8P	1A Ultra-Low Vin Low Dropout Voltage Linear Regulator VER 1.1
SHANGHAI BELLING CO., L...	BL8073	995Kb / 5P	1A Ultra-Low Vin Low Dropout Voltage Linear Regulator
Linear Technology	LT3060	283Kb / 20P	45V VIN, Micropower, Low Noise, 100mA Low Dropout, Linear Regulator
	LT3060	382Kb / 26P	45V VIN, Micropower, Low Noise, 100mA Low Dropout, Linear Regulator
	LT3060	441Kb / 26P	45V VIN, Micropower, Low Noise, 100mA Low Dropout, Linear Regulator
Analog Devices	ADP1765	782Kb / 20P	5 A, Low VIN, Low Noise, CMOS Linear Regulator Rev. A

More results

ADP1753-EVALZ Arkusz danych(PDF) 5 Page - Analog Devices

ADP1753-EVALZ Arkusz danych(HTML) 5 Page - Analog Devices

Podobny numer części - ADP1753-EVALZ

Podobny opis - ADP1753-EVALZ

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Arkusz danych Pobierz

Link URL