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CS70-B2GA151KYNSA Arkusz danych(PDF) 4 Page - TDK Electronics

Numer części CS70-B2GA151KYNSA
Szczegółowy opis  Mid-high Voltage Ceramic Capacitors Disk type with lead Safety standard approved
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Producent  TDK [TDK Electronics]
Strona internetowa  http://www.tdk.com
Logo TDK - TDK Electronics

CS70-B2GA151KYNSA Arkusz danych(HTML) 4 Page - TDK Electronics

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005-03 / 20111003 / e4b3_cs.fm
• All specifications are subject to change without notice.
TAPING DIMEMSIONS
VERTICAL KINK LEAD TYPE
Item
Symbol
Dimensions(mm)
Remarks
V1
V2
V3
Body diameter
D
Depends on the specification of each product.
Body thickness
T
Depends on the specification of each product.
Lead-wire diameter
ød
0.6±0.05
0.6±0.05
0.6±0.05
Pitch of component
P
12.7±1.0
15.0±1.0
30.0±1.0
Including the slant of body
Feed hole pitch
P0
12.7±0.3
15.0±0.3
15.0±0.3
Excepting the tape splicing part
Feed hole center to lead
P1
3.85±0.7
3.75±0.7
3.75±0.7
Feed hole center to component
center
P2
6.35±1.3
7.5±1.3
7.5±1.3
Lead-to lead distance
F
5+0.8, –0.2
7.5±0.8
7.5±0.8
Measuring point is bottom kink
Component alignment
∆h
0±2.0
0±2.0
0±2.0
Including the slanting body due to bending lead-wire
Tape width
W
18.0+1.0, –0.5 18.0+1.0, –0.5 18.0+1.0, –0.5
Adhesive tape width
W0
11.5min.
11.5min.
11.5min.
Hole position
W1
9.0±0.5
9.0±0.5
9.0±0.5
Adhesive tape position
W2
3.0max.
3.0max.
3.0max.
Adhesive tape do not stick out the tape
Bottom of kink from tape center
H0
16.0+1.5, –0.5 16.0+1.5, –0.5 16.0+1.5, –0.5
Height of body from tape center
H1
46.0max.
46.0max.
46.0max.
Lead-wire protrusion
1.0max.
1.0max.
1.0max.
Feed hole diameter
D0
4.0±0.2
4.0±0.2
4.0±0.2
Total tape thickness
t
0.6±0.3
0.6±0.3
0.6±0.3
Do not including adhesive tape
Length of snipped lead
L
11.0max.
11.0max.
11.0max.
Coating on lead
C
4.0max.
4.0max.
4.0max.
Height of kink
A
4.0max.
4.0max.
4.0max.
Measuring point is bottom kink
Spring action
S
2.0max.
2.0max.
2.0max.
P
P2
D
P0
D0
ød
T
∆h
∆h
S
F
P1
V1, V2
P
P2
D
P0
ød
T
∆h
∆h
S
F
P1
D0
V3
• For more information about products with other capacitance or other data, please contact us.


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