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CDCM7005RGZTG4 Arkusz danych(PDF) 6 Page - Texas Instruments |
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CDCM7005RGZTG4 Arkusz danych(HTML) 6 Page - Texas Instruments |
6 / 45 page CDCM7005 SCAS793E – JUNE 2005 – REVISED FEBRUARY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE / UNIT VCC, AVCC, VCC_CP Supply voltage range (2) –0.5 V to 4.6 V VI Input voltage range (3) –0.5 V to VCC + 0.5 V VO Output voltage range (3) –0.5 V to VCC + 0.5 V Output current for LVPECL/LVCMOS outputs IOUT ±50 mA (0 < VO < VCC) IIN Input current (VI < 0, VI > VCC) ±20 mA Tstg Storage temperature range –65°C to 150°C TJ Maximum junction temperature 125°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All supply voltages have to be supplied at the same time. (3) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed. Package Thermal Resistance for RGZ (QFN) Package (1) (2) Airflow (lfm) θJA (°C/W) θJC (°C/W) θJP (°C/W) (3) ψJT (°C/W) 0 29.9 22.4 1.5 0.2 150 24.7 0.2 250 23.2 0.2 500 21.5 0.3 (1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (2) Connected to GND with nine thermal vias (0,3 mm diameter). (3) θJP (junction pad) is used for the QFN package, because the main heat flow is from the junction to the GND pad of the QFN. Package Thermal Resistance for ZVA (BGA) Package (1) Airflow (m/s) θJA (°C/W) θJC (°C/W) θJB (°C/W) (2) ψJT (°C/W) 0 m/s 53.9 28.3 38.6 0.7 1 m/s 49.8 0.7 2 m/s 48.5 0.8 (1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (2) θJB (junction board) is used for the BGA package, because the main heat flow is from junction to the board. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT VCC, AVCC 3 3.3 3.6 Supply voltage V VCC_CP 2.3 VCC VIL Low-level input voltage LVCMOS, see (1) 0.3 VCC V VIH High-level input voltage LVCMOS, see (1) 0.7 VCC V IOH High-level output current LVCMOS (includes all status pins) –8 mA IOL Low-level output current LVCMOS (includes all status pins) 8 mA VI Input voltage range LVCMOS 0 3.6 V VINPP Input amplitude LVPECL (VVCXO_IN – V VCXO_IN ) (2) 0.5 1.3 V VIC Common-mode input voltage LVPECL 1 VCC–0.3 V TA Operating free-air temperature –40 85 °C (1) VIL and VIH are required to maintain ac specifications; the actual device function tolerates a smaller input level of 1V, if an ac-coupling to VCC/2 is provided. (2) VINPP minimum and maximum is required to maintain ac specifications; the actual device function tolerates at a minimum VINPP of 150 mV. 6 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links :CDCM7005 |
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