5

All Avago data sheets report the creepage and clearance

inherent to the optocoupler component itself. These

dimensions are needed as a starting point for the equip-

ment designer when determining the circuit insulation

requirements. However, once mounted on a printed

circuit board, minimum creepage and clearance require-

ments must be met as specified for individual equipment

standards. For creepage, the shortest distance path along

Insulation and Safety Related Specifications

Value

Parameter

Symbol

772X

072X

Units

Conditions

Minimum External Air

L(I01)

7.1

4.9

mm

Measured from input terminals to output

Gap (Clearance)

terminals, shortest distance through air.

Minimum External

L(I02)

7.4

4.8

mm

Measured from input terminals to output

Tracking (Creepage)

terminals, shortest distance path along body.

Minimum Internal Plastic

0.08

0.08

mm

Insulation thickness between emitter and

Gap (Internal Clearance)

detector; also known as distance through

insulation.

Tracking Resistance

CTI

≥175

≥175

Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking

Index)

Isolation Group

IIIa

IIIa

Material Group

(DIN VDE 0110, 1/89, Table 1)

the surface of a printed circuit board between the solder

fillets of the input and output leads must be considered.

There are recommended techniques such as grooves

and ribs which may be used on a printed circuit board to

achieve desired creepage and clearances. Creepage and

clearance distances will also change depending on fac-

tors such as pollution degree and insulation level.

Regulatory Information

The HCPL-772X/072X have been approved by the following organizations:

UL

Recognized under UL 1577, component recognition program, File E55361.

CSA

Approved under CSA Component Acceptance Notice #5, File CA88324.

IEC/EN/DIN EN 60747-5-5

Solder Reflow Thermal Profile

Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-

Halide Flux should be used.