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ADS62P48 Arkusz danych(PDF) 2 Page - Texas Instruments

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Numer części ADS62P48
Szczegółowy opis  Dual-Channel, 11-Bit, 250-MSPS ADC With DDR LVDS and Parallel CMOS Outputs
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

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ADS62P19
SLAS937 – APRIL 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
SPECIFIED TEMPERATURE
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
TRANSPORT MEDIA
RANGE
ADS62P19
QFN-64
RGC
–40°C to +85°C
Tape and Reel
ADS62P28
QFN-64
RGC
–40°C to +85°C
Tape and Reel
ADS62P29
QFN-64
RGC
–40°C to +85°C
Tape and Reel
ADS62P48
QFN-64
RGC
–40°C to +85°C
Tape and Reel
ADS62P49
QFN-64
RGC
–40°C to +85°C
Tape and Reel
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
AVDD
–0.3 V to 3.9
V
Supply voltage range
DRVDD
–0.3 V to 2.2
V
Voltage between AGND and DRGND
–0.3 to 0.3
V
AVDD leads DRVDD during power-up and DRVDD
Voltage between AVDD to DRVDD
–0.3 to 4.2
V
leads AVDD during power-down
DRVDD leads AVDD during power-up and AVDD leads
Voltage between DRVDD to AVDD
–2.5 to 1.7
V
DRVDD during power-down
Voltage applied to external pin
VCM (in external reference mode)
–0.3 to 2.0
V
Voltage applied to analog input pins
INP_A, INM_A, INP_B, INM_B
–0.3 to minimum (3.6, AVDD + 0.3)
V
CLKP, CLKM(2), RESET, SCLK, SDATA, SEN, CTRL1,
Voltage applied to input pins
–0.3 to AVDD + 0.3
V
CTRL2, CTRL3
Operating free-air, TA
–40 to +85
°C
Temperature range
Operating junction, TJ
+125
°C
Storage, Tstg
–65 to +150
°C
Electrostatic discharge (ESD) rating
Human body model (HBM)
2
kV
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2)
When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP, CLKM is < |0.3 V|). This
setting prevents the ESD protection diodes at the clock input pins from turning on.
THERMAL INFORMATION
ADS62P19
THERMAL METRIC(1)
RGC PACKAGE
UNITS
64 PINS
θJA
Junction-to-ambient thermal resistance
23.0
θJCtop
Junction-to-case (top) thermal resistance
10.5
θJB
Junction-to-board thermal resistance
4.2
°C/W
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
4.2
θJCbot
Junction-to-case (bottom) thermal resistance
0.57
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: ADS62P19


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