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ADS62P48 Arkusz danych(PDF) 2 Page - Texas Instruments |
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ADS62P48 Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 65 page ADS62P19 SLAS937 – APRIL 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) SPECIFIED TEMPERATURE PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR TRANSPORT MEDIA RANGE ADS62P19 QFN-64 RGC –40°C to +85°C Tape and Reel ADS62P28 QFN-64 RGC –40°C to +85°C Tape and Reel ADS62P29 QFN-64 RGC –40°C to +85°C Tape and Reel ADS62P48 QFN-64 RGC –40°C to +85°C Tape and Reel ADS62P49 QFN-64 RGC –40°C to +85°C Tape and Reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT AVDD –0.3 V to 3.9 V Supply voltage range DRVDD –0.3 V to 2.2 V Voltage between AGND and DRGND –0.3 to 0.3 V AVDD leads DRVDD during power-up and DRVDD Voltage between AVDD to DRVDD –0.3 to 4.2 V leads AVDD during power-down DRVDD leads AVDD during power-up and AVDD leads Voltage between DRVDD to AVDD –2.5 to 1.7 V DRVDD during power-down Voltage applied to external pin VCM (in external reference mode) –0.3 to 2.0 V Voltage applied to analog input pins INP_A, INM_A, INP_B, INM_B –0.3 to minimum (3.6, AVDD + 0.3) V CLKP, CLKM(2), RESET, SCLK, SDATA, SEN, CTRL1, Voltage applied to input pins –0.3 to AVDD + 0.3 V CTRL2, CTRL3 Operating free-air, TA –40 to +85 °C Temperature range Operating junction, TJ +125 °C Storage, Tstg –65 to +150 °C Electrostatic discharge (ESD) rating Human body model (HBM) 2 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (2) When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP, CLKM is < |0.3 V|). This setting prevents the ESD protection diodes at the clock input pins from turning on. THERMAL INFORMATION ADS62P19 THERMAL METRIC(1) RGC PACKAGE UNITS 64 PINS θJA Junction-to-ambient thermal resistance 23.0 θJCtop Junction-to-case (top) thermal resistance 10.5 θJB Junction-to-board thermal resistance 4.2 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 4.2 θJCbot Junction-to-case (bottom) thermal resistance 0.57 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: ADS62P19 |
Podobny numer części - ADS62P48 |
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Podobny opis - ADS62P48 |
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