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LM3630ATME Arkusz danych(PDF) 4 Page - Texas Instruments |
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LM3630ATME Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 45 page LM3630A SNVS974 – APRIL 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) VALUE UNIT IN, HWEN, PWM, SCL, SDA, INTN, SEL to −0.3 to 6.0 GND V SW, OVP, ILED1, ILED2 to GND −0.3 to 45 Continuous Power Dissipation (3) Internally Limited Maximum Junction Temperature 150 Storage Temperature Range −45 to +150 T(J-MAX) Maximum Lead Temperature (Soldering) (4) 215 °C Vapor Phase (60 sec.) Maximum Lead Temperature (Soldering) (4) 220 Infrared (15 sec.) Human Body Model 2 kV ESD Rating (5) Charged Device Mod 500 V Operating Ratings (1) (2) VIN Input Voltage Range 2.3 to 5.5 V TA Operating Ambient Temperature Range (6) −40 to +85 °C Thermal Properties θJA Junction-to-Ambient Thermal Resistance, YFQ12 78.1 °C/W package (7) (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pin. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 140°C (typ.) and disengages at TJ = 125°C (typ.). (4) For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level Chip Scale Package (AN-1112) (5) The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. (MIL-STD-883 3015.7) . (6) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). (7) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level Chip Scale Package. 4 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: LM3630A |
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