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LM1875T Arkusz danych(PDF) 9 Page - Texas Instruments |
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LM1875T Arkusz danych(HTML) 9 Page - Texas Instruments |
9 / 16 page LM1875 www.ti.com SNAS524A – MAY 2004 – REVISED MAY 2004 NOTE When using a single supply, maximum transfer of heat away from the LM1875 can be achieved by mounting the device directly to the heat sink (tab is at ground potential); this avoids the use of a mica or other type insulator. The thermal requirements can become more difficult when an amplifier is driving a reactive load. For a given magnitude of load impedance, a higher degree of reactance will cause a higher level of power dissipation within the amplifier. As a general rule, the power dissipation of an amplifier driving a 60° reactive load (usually considered to be a worst-case loudspeaker load) will be roughly that of the same amplifier driving the resistive part of that load. For example, a loudspeaker may at some frequency have an impedance with a magnitude of 8 Ω and a phase angle of 60°. The real part of this load will then be 4Ω, and the amplifier power dissipation will roughly follow the curve of power dissipation with a 4 Ω load. Component Layouts Figure 14. Split Supply Copyright © 2004, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: LM1875 |
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