5

MRF177

MOTOROLA RF DEVICE DATA

D1

R3

R2

R1

C13

RF

INPUT

C1

T1

C2

C3

C5

C6

C7

MS1

MS2

R4

MRF177

MS3

MS4

C8

C10

C11

T4

RF

OUTPUT

C18

C17

L1

FERRITE BEAD

FERRITE BEAD

FERRITE BEAD

L2

C16

MICROSTRIP DETAIL

0.325

″

0.15

″

0.45

″

0.10

″

MS1

0.45

″

0.15

″

0.325

″

0.10

″

MS2

0.325

″

0.15

″

0.10

″

0.45

″

MS3

MS4

0.10

″

0.325

″

0.15

″

0.45

″

Figure 8. Test Circuit Electrical Schematic

C12

++

R5

T2

D.U.T.

C9

T3

VDD = 28 V

+

C14

C15

+

+

C4

C1, C12

1–10 pF JOHANSON OR EQUIVALENT

C2, C3, C5, C6, C10, C11

270 pF ATC 100 MIL CHIP CAP

C4, C9

1–20 pF

C7

36 pF CHIP CAP

C8

10 pF CHIP CAP

C13, C14

0.1

µFD @ 50 Vdc

C15, C18

10

µFD @ 50 Vdc

C16

500 pF BUTTON

C17

1000 pF UNCASED MICA

D1

1N5347B, 20 Vdc

L1

1–TURN NO. 18, 0.25

″, 2–HOLE FERRITE BEAD

L2

8–1/2 TURNS NO. 18, CLOSE WOUND .375

″ DIA.

R1, R4, R5

10 k

Ω @ 1/2 W RESISTOR

R2

10 k

Ω, 10 TURN RESISTOR

R3

2.0 k

Ω @ 1/2 W RESISTOR

T1

1–1/2 T, 50

Ω COAX, .034″ DIA. ON DUAL 0.5″ FERRITE CORE

T2

2.0

″ 25 Ω COAX, .075″ DIA.

T3

2.1

″ 10 Ω COAX, .075″ DIA.

T4

4.0

″ 50 Ω COAX, .0865″ DIA.

BOARD

Dielectric Thickness = 0.060

″ 2oz Copper, Cu–Clad, Teflon Fiberglass, εr = 2.55