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FSTUD16211 Arkusz danych(PDF) 1 Page - Fairchild Semiconductor

Numer części FSTUD16211
Szczegółowy opis  24-Bit Bus Switch with -2V Undershoot Protection and Level Shifting
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Producent  FAIRCHILD [Fairchild Semiconductor]
Strona internetowa  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

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© 2001 Fairchild Semiconductor Corporation
DS500390
www.fairchildsemi.com
June 2000
Revised August 2001
FSTUD16211
24-Bit Bus Switch with
−2V Undershoot Protection
and Level Shifting
General Description
The Fairchild Switch FSTUD16211 provides 24-bits of
high-speed CMOS TTL-compatible bus switching. The low
on resistance of the switch allows inputs to be connected to
outputs without adding propagation delay or generating
additional ground bounce noise. A diode to VCC has been
integrated into the circuit to allow for level shifting between
5V inputs and 3.3V outputs.
The device is organized as a 12-bit or 24-bit bus switch.
When OE1 is LOW, the switch is ON and Port 1A is con-
nected to Port 1B. When OE2 is LOW, Port 2A is connected
to Port 2B. When OE1/2 is HIGH, a high impedance state
exists between the A and B Ports. The A and B Ports have
“undershoot hardened” circuit protection to support an
extended range to 2.0V below ground. Fairchild’s inte-
grated Undershoot Hardened Circuit (UHC
) senses
undershoot at the I/O’s, and responds by preventing volt-
age differentials from developing and turning on the switch.
Features
s Undershoot hardened to
−2V (A and B Ports)
s Voltage level shifting
s 4
Ω switch connection between two ports
s Minimal propagation delay through the switch
s Low lCC
s Zero bounce in flow-through mode
s Control inputs compatible with TTL level
s See Applications Note AN-5008 for details
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 1: BGA package available in Tape and Reel only.
Logic Diagram
UHC
 is a trademark of Fairchild Semiconductor Corporation.
Order Number
Package Number
Package Description
FSTUD16211GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
FSTUD16211MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide


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