CMOS Low Voltage

2.5 Ω Dual SPDT Switch

Data Sheet

ADG736

Rev. D

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FEATURES

1.8 V to 5.5 V single supply

Automotive temperature range: −40°C to +125°C

2.5 Ω (typical) on resistance

Low on resistance flatness

−3 dB bandwidth > 200 MHz

Rail-to-rail operation

10-lead MSOP package

Fast switching times

Typical power consumption (<0.01 μW)

TTL-/CMOS-compatible

Qualified for automotive applications

APPLICATIONS

USB 1.1 signal switching circuits

Cell phones

PDAs

Battery-powered systems

Communications systems

Sample-and-hold systems

Audio signal routing

Audio and video switching

Mechanical reed relay replacement

FUNCTIONAL BLOCK DIAGRAM

SWITCHES SHOWN

FOR A LOGIC 1 INPUT

ADG736

S1A

S1B

D1

IN1

S2B

IN2

D2

S2A

2

10

6

9

1

4

7

5

Figure 1.

GENERAL DESCRIPTION

The ADG736 is a monolithic device comprising two independ-

ently selectable CMOS single pole, double throw (SPDT) switches.

These switches are designed using a submicron process that

provides low power dissipation yet gives high switching speed,

low on resistance, low leakage currents, and wide input signal

bandwidth.

The on resistance profile is very flat over the full analog signal

range. This ensures excellent linearity and low distortion when

switching audio signals. Fast switching speed also makes the

part suitable for video signal switching.

The ADG736 operates from a single 1.8 V to 5.5 V supply,

making it ideally suited to portable and battery-powered

instruments.

Each switch conducts equally well in both directions when on, and

each has an input signal range that extends to the power supplies.

The ADG736 exhibits break-before-make switching action.

The ADG736 is available in a 10-lead MSOP package.

PRODUCT HIGHLIGHTS

1.

1.8 V to 5.5 V Single-Supply Operation. The ADG736

offers high performance, including low on resistance and

fast switching times. It is fully specified and guaranteed

with 3 V and 5 V supply rails.

2.

temperature range.

3.

Low On Resistance Flatness.

4.

−3 dB Bandwidth > 200 MHz.

5.

Low Power Dissipation. CMOS construction ensures low

power dissipation.

6.

7.

Break-Before-Make Switching Action.

8.

10-Lead MSOP Package.