ADT7301

Rev. B | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

V

−0.3 V to +7 V

Digital Input Voltage to GND

−0.3 V to V

Digital Output Voltage to GND

−0.3 V to V

Operating Temperature Range1

−40°C to +150°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

6-Lead SOT-23 (RJ-6)

Power Dissipation2

W

JA

Thermal Impedance

θ

(Still Air)

190.4°C/W

8-Lead MSOP (RM-8)

Power Dissipation2

W

JA

Thermal Impedance4

θ

(Still Air)

205.9°C/W

θ

43.74°C/W

IR Reflow Soldering

Peak Temperature

220°C (0°C/5°C)

Time at Peak Temperature

10 sec to 20 sec

Ramp-Up Rate

3°C/s max

Ramp-Down Rate

−6°C/s max

Time 25°C to Peak Temperature

6 minutes max

IR Reflow Soldering—Pb-Free Package

Peak Temperature

260°C (0°C)

Time at Peak Temperature

20 sec to 40 sec

Ramp-Up Rate

3°C/s max

Ramp-Down Rate

−6°C/s max

Time 25°C to Peak Temperature

8 minutes max

125°C for greater than a total of 5% (5,000 hours) of the lifetime of the

device. Any exposure beyond this limit affects device reliability.

to Figure 3 for a plot of maximum power dissipation vs. ambient

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air-cooled,

PCB-mounted components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

TEMPERATURE (

°C)

1.2

1.0

0.8

0.6

0.4

0.2

0

SOT-23

MSOP

Figure 3. Plot of Maximum Power Dissipation vs. Temperature

ESD CAUTION