Zakładka z wyszukiwarką danych komponentów |
|
SL3S1002FTB1,115 Arkusz danych(PDF) 5 Page - NXP Semiconductors |
|
SL3S1002FTB1,115 Arkusz danych(HTML) 5 Page - NXP Semiconductors |
5 / 51 page 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 9 October 2012 139037 5 of 51 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 6. Wafer layout and pinning information 6.1 Wafer layout (1) X-scribe line width: 56.4 m (2) Y-scribe line width: 56.4 m (3) Chip step, x-length: 488.0 m (4) Chip step, y-length: 470,0 m (5) Bump to bump distance X (TP1 - RFN): 351,0 m (6) Bump to bump distance Y (RFN - RFP): 333,0 m (7) Distance bump to metal sealring X: 40,3 m (8) Distance bump to metal sealring Y: 40,3 m Bump size X x Y: 60 m x 60 m Fig 2. Wafer layout and pinning information 001aai346 not to scale! (1) (7) (2) (8) (5) (6) (4) (3) Y X TP2 TP1 RFN RFP |
Podobny numer części - SL3S1002FTB1,115 |
|
Podobny opis - SL3S1002FTB1,115 |
|
|
Link URL |
Polityka prywatności |
ALLDATASHEET.PL |
Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |