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LM341T-5.0 Arkusz danych(PDF) 7 Page - Texas Instruments |
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LM341T-5.0 Arkusz danych(HTML) 7 Page - Texas Instruments |
7 / 13 page Typical Performance Characteristics (Continued) Quiescent Current Output Impedance 01048416 01048417 Line Transient Response Load Transient Response 01048407 01048408 Design Considerations The LM78MXX/LM341XX fixed voltage regulator series has built-in thermal overload protection which prevents the de- vice from being damaged due to excessive junction tem- perature. The regulators also contain internal short-circuit protection which limits the maximum output current, and safe-area protection for the pass transistor which reduces the short- circuit current as the voltage across the pass transistor is increased. Although the internal power dissipation is automatically lim- ited, the maximum junction temperature of the device must be kept below +125˚C in order to meet data sheet specifica- tions. An adequate heatsink should be provided to assure this limit is not exceeded under worst-case operating condi- tions (maximum input voltage and load current) if reliable performance is to be obtained). 1.0 HEATSINK CONSIDERATIONS When an integrated circuit operates with appreciable cur- rent, its junction temperature is elevated. It is important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by sum- ming the individual parts consisting of a series of tempera- ture rises from the semiconductor junction to the operating environment. A one-dimension steady-state model of con- duction heat transfer is demonstrated in The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case mate- rial, to the printed circuit board, and eventually to the ambi- ent environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink. Rθ JC(Component Variables) Rθ CA(Application Variables) Leadframe Size & Material Mounting Pad Size, Material, & Location No. of Conduction Pins Placement of Mounting Pad Die Size PCB Size & Material Die Attach Material Traces Length & Width Molding Compound Size and Material Adjacent Heat Sources Volume of Air Air Flow Ambient Temperature Shape of Mounting Pad www.national.com 6 |
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