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LM341T-5.0 Arkusz danych(PDF) 7 Page - Texas Instruments

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Numer części LM341T-5.0
Szczegółowy opis  3-Terminal Positive Voltage Regulators
Download  13 Pages
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
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LM341T-5.0 Arkusz danych(HTML) 7 Page - Texas Instruments

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Typical Performance Characteristics (Continued)
Quiescent Current
Output Impedance
01048416
01048417
Line Transient Response
Load Transient Response
01048407
01048408
Design Considerations
The LM78MXX/LM341XX fixed voltage regulator series has
built-in thermal overload protection which prevents the de-
vice from being damaged due to excessive junction tem-
perature.
The regulators also contain internal short-circuit protection
which limits the maximum output current, and safe-area
protection for the pass transistor which reduces the short-
circuit current as the voltage across the pass transistor is
increased.
Although the internal power dissipation is automatically lim-
ited, the maximum junction temperature of the device must
be kept below +125˚C in order to meet data sheet specifica-
tions. An adequate heatsink should be provided to assure
this limit is not exceeded under worst-case operating condi-
tions (maximum input voltage and load current) if reliable
performance is to be obtained).
1.0 HEATSINK CONSIDERATIONS
When an integrated circuit operates with appreciable cur-
rent, its junction temperature is elevated. It is important to
quantify its thermal limits in order to achieve acceptable
performance and reliability. This limit is determined by sum-
ming the individual parts consisting of a series of tempera-
ture rises from the semiconductor junction to the operating
environment. A one-dimension steady-state model of con-
duction heat transfer is demonstrated in The heat generated
at the device junction flows through the die to the die attach
pad, through the lead frame to the surrounding case mate-
rial, to the printed circuit board, and eventually to the ambi-
ent environment. Below is a list of variables that may affect
the thermal resistance and in turn the need for a heatsink.
Rθ
JC(Component
Variables)
Rθ
CA(Application
Variables)
Leadframe Size & Material
Mounting Pad Size,
Material, & Location
No. of Conduction Pins
Placement of Mounting Pad
Die Size
PCB Size & Material
Die Attach Material
Traces Length & Width
Molding Compound Size
and Material
Adjacent Heat Sources
Volume of Air
Air Flow
Ambient Temperature
Shape of Mounting Pad
www.national.com
6


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