LM3639A

www.ti.com

SNVS964 – MARCH 2013

ABSOLUTE MAXIMUM RATINGS

(1)

−0.3V to 6V

max

−0.3V to +45V

Storage Temperature Range

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

OPERATING RATINGS

(1) (2)

2.5V to 5.5V

−40°C to +125°C

(3)

−40°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics table.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

THERMAL PROPERTIES

Thermal Junction-to-Ambient Resistance (

(1)

48.8°C/W

(1)

Junction-to-ambient thermal resistance (

forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2 x 1 array

of thermal vias. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36

μm/18μm/18μm/36μm

(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C in still air. Power dissipation is 1W. In applications where high

maximum power dissipation exists special care must be paid to thermal dissipation issues.

Copyright © 2013, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Links: LM3639A