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LM3639AYFQR Arkusz danych(PDF) 3 Page - Texas Instruments |
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LM3639AYFQR Arkusz danych(HTML) 3 Page - Texas Instruments |
3 / 28 page LM3639A www.ti.com SNVS964 – MARCH 2013 ABSOLUTE MAXIMUM RATINGS (1) VIN (2) (3) −0.3V to 6V −0.3V to the lesser of (VIN+0.3V) w/ 6V SWF, OUTF, FLED1, FLED2, EN, PWM, SCL, SDA, TX, STROBE (2) max SWB, OVP, BLED1, BLED2 (2) −0.3V to +45V Storage Temperature Range −65°C to +150°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics table. (2) All voltages are with respect to the potential at the GND pin. (3) VIN can be below −0.3V if the current out of the pin is limited to 500 µA. OPERATING RATINGS (1) (2) VIN 2.5V to 5.5V Junction Temperature (TJ) −40°C to +125°C Ambient Temperature (TA) (3) −40°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics table. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES Thermal Junction-to-Ambient Resistance ( θJA) (1) 48.8°C/W (1) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2 x 1 array of thermal vias. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36 μm/18μm/18μm/36μm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C in still air. Power dissipation is 1W. In applications where high maximum power dissipation exists special care must be paid to thermal dissipation issues. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3639A |
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