Precautions

Lead Forming

• The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering into PC board.

• If lead forming is required before soldering, care must

be taken to avoid any excessive mechanical stress

induced to LED package. Otherwise, cut the leads

of LED to length after soldering process at room

temperature. The solder joint formed will absorb the

mechanical stress of the lead cutting from traveling to

the LED chip die attach and wirebond.

• It is recommended that tooling made to precisely

form and cut the leads to length rather than rely upon

hand operation.

Soldering Conditions

• CaremustbetakenduringPCBassemblyandsoldering

process to prevent damage to LED component.

• The closest LED is allowed to solder on board is 1.59

mm below the body (encapsulant epoxy) for those

parts without standoff.

• Recommended soldering conditions:

• Wavesolderingparametermustbesetandmaintained

according to recommended temperature and dwell

time in the solder wave. Customer is advised to

periodically check on the soldering profile to ensure

the soldering profile used is always conforming to

recommended soldering condition.

• If necessary, use fixture to hold the LED component

in proper orientation with respect to the PCB during

soldering process.

• Proper handling is imperative to avoid excessive

thermal stresses to LED components when heated.

Therefore, the soldered PCB must be allowed to cool

to room temperature, 25°C, before handling.

• Special attention must be given to board fabrication,

solder masking, surface plating and lead holes size

and component orientation to assure solderability.

• Recommended PC board plated through hole sizes

for LED component leads:

LED Component

Lead Size

Diagonal

Plated Through

-Hole Diameter

Lead size (typ.)

0.45 × 0.45 mm

(0.018 × 0.018 in.)

0.636 mm

(0.025 in)

0.98 to 1.08 mm

(0.039 to 0.043 in)

Dambar shear-

off area (max.)

0.65 mm

(0.026 in)

0.919 mm

(0.036 in)

Lead size (typ.)

0.50 × 0.50 mm

(0.020 × 0.020 in.)

0.707 mm

(0.028 in)

1.05 to 1.15 mm

(0.041 to 0.045 in)

Dambar shear-

off area (max.)

0.70 mm

(0.028 in)

0.99 mm

(0.039 in)

on soldering LED components.

Manual Solder

Wave Soldering

Dipping

Pre-heat Temperature

105 °C Max.

–

Pre-heat Time

30 sec Max.

–

Peak Temperature

250 °C Max.

260 °C Max.

Dwell Time

3 sec Max.

5 sec Max.

Figure 17. Recommended wave soldering profile.

For product information and a complete list of distributors, please go to our website:

www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4259EN

AV02-1023EN - July 24, 2013

LAMINAR WAVE

BOTTOM SIDE

OF PC BOARD

HOT AIR KNIFE

TURBULENT WAVE

FLUXING

PREHEAT

0

10

20

30

50

100

150

200

250

30

40

50

TIME – SECONDS

60

70

80

90

100

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150C (100C PCB)

SOLDER WAVE TEMPERATURE = 245C

AIR KNIFE AIR TEMPERATURE = 390C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

SOLDER: SN63; FLUX: RMA

NOTE: ALLOW FOR BOARDS TO BE

SUFFICIENTLY COOLED BEFORE EXERTING

MECHANICAL FORCE.