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ADG759BCPZ Arkusz danych(PDF) 5 Page - Analog Devices |
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ADG759BCPZ Arkusz danych(HTML) 5 Page - Analog Devices |
5 / 12 page ADG758/ADG759 Rev. B | Page 5 ABSOLUTE MAXIMUM RATINGS TA = 25C, unless otherwise noted. Parameter Rating VDD to VSS 7 V VDD to GND –0.3 V to +7 V VSS to GND +0.3 V to –3.5 V Analog Inputs1 VSS – 0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Digital Inputs1 –0.3 V to VDD +0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D 100 mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D 30 mA Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature 150°C Chip Scale Package, θJA Thermal Impedance 32°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C 1 Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Table I. ADG758 Truth Table A2 A1 A0 EN Switch Condition X X X 0 NONE 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 X = Don’t Care Table II. ADG759 Truth Table A1 A0 EN ON Switch Pair X X 0 NONE 0 0 1 1 0 1 1 2 1 0 1 3 1 1 1 4 X = Don’t Care PIN CONFIGURATIONS 14 13 12 1 3 4 VDD 15 GND S5 S6 11 S7 EN S1 2 VSS S2 5 S3 ADG758 TOP VIEW (Not to Scale) NOTES 1. NC = NO CONNECT. 2. EXPOSED PAD TIED TO SUBSTRATE, VSS. 14 13 12 1 3 4 VDD 15 GND S1B S2B 11 S3B EN S1A 2 VSS S2A 5 S3A ADG759 TOP VIEW (Not to Scale) NOTES 1. NC = NO CONNECT. 2. EXPOSED PAD TIED TO SUBSTRATE, VSS. |
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