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ADS4229 Arkusz danych(PDF) 3 Page - Texas Instruments

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Numer części ADS4229
Szczegółowy opis  Dual-Channel, 12-Bit, 250-MSPS Ultralow-Power ADC
Download  67 Pages
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

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ADS4229
www.ti.com
SBAS550B – JUNE 2011 – REVISED AUGUST 2012
ABSOLUTE MAXIMUM RATINGS
(1)
ADS4229
MIN
MAX
UNIT
Supply voltage range, AVDD
–0.3
2.1
V
Supply voltage range, DRVDD
–0.3
2.1
V
Voltage between AGND and DRGND
–0.3
0.3
V
Voltage between AVDD to DRVDD (when AVDD leads DRVDD)
–2.4
2.4
V
Voltage between DRVDD to AVDD (when DRVDD leads AVDD)
–2.4
2.4
V
Minimum
INP_A, INM_A, INP_B, INM_B
–0.3
V
(1.9, AVDD + 0.3)
Voltage applied to input pins
CLKP, CLKM(2)
–0.3
AVDD + 0.3
V
RESET, SCLK, SDATA, SEN,
–0.3
3.9
V
CTRL1, CTRL2, CTRL3
Operating free-air temperature range, TA
–40
+85
°C
Operating junction temperature range, TJ
+125
°C
Storage temperature range, Tstg
–65
+150
°C
ESD rating
Human body model (HBM)
2
kV
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2)
When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is less than |0.3 V|).
This configuration prevents the ESD protection diodes at the clock input pins from turning on.
THERMAL INFORMATION
ADS4229
THERMAL METRIC
RGC
UNITS
64 PINS
θJA
Junction-to-ambient thermal resistance
23.9
θJCtop
Junction-to-case (top) thermal resistance
10.9
θJB
Junction-to-board thermal resistance
4.3
°C/W
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
4.4
θJCbot
Junction-to-case (bottom) thermal resistance
0.6
Copyright © 2011–2012, Texas Instruments Incorporated
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