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ADT6504SRJZN015RL7 Arkusz danych(PDF) 4 Page - Analog Devices |
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ADT6504SRJZN015RL7 Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 16 page ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet Rev. B | Page 4 of 16 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VCC to GND −0.3 V to +7 V HYST Input Voltage to GND −0.3 V to VCC + 0.3 V Open-Drain Output Voltage to GND −0.3 V to +7 V Push-Pull Output Voltage to GND −0.3 V to VCC + 0.3 V Input Current on All Pins 20 mA Output Current on All Pins 20 mA Operating Temperature Range −55°C to +125°C Storage Temperature Range −65°C to +160°C Maximum Junction Temperature, TJMAX 150.7°C 5-Lead SOT-23 (RJ-5) Power Dissipation1 WMAX = (TJMAX − TA2)/θJA Thermal Impedance3 θJA, Junction-to-Ambient (Still Air) 240°C/W IR Reflow Soldering (RoHS Compliant Package) Peak Temperature 260°C (+0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate −6°C/sec maximum Time 25°C to Peak Temperature 8 minute maximum 1 Values relate to package being used on a standard 2-layer PCB. This gives a worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature ESD CAUTION 0.9 0 125 TEMPERATURE (°C) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 –55 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120 SOT-23 PD @ 125°C = 0.107W |
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