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74ACT373SJ Arkusz danych(PDF) 11 Page - Fairchild Semiconductor |
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74ACT373SJ Arkusz danych(HTML) 11 Page - Fairchild Semiconductor |
11 / 14 page ©1988 Fairchild Semiconductor Corporation www.fairchildsemi.com 74AC373, 74ACT373 Rev. 1.5.0 11 Physical Dimensions (Continued) Figure 3. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ |
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