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AD630SCHIPS Arkusz danych(PDF) 4 Page - Analog Devices

Numer części AD630SCHIPS
Szczegółowy opis  Balanced Modulator/Demodulator
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

AD630SCHIPS Arkusz danych(HTML) 4 Page - Analog Devices

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REV. E
AD630
–3–
THERMAL CHARACTERISTICS
JC
JA
20-Lead PDIP (N)
24
°C/W
61
°C/W
20-Lead Ceramic DIP (D)
35
°C/W
120
°C/W
20-Lead Leadless Chip Carrier LCC (E)
35
°C/W
120
°C/W
20-Lead SOIC (R-20)
38
°C/W
75
°C/W
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . 600 mW
Output Short-Circuit to Ground . . . . . . . . . . . . . . . Indefinite
Storage Temperature, Ceramic Package . . . –65
°C to +150°C
Storage Temperature, Plastic Package . . . . . –55
°C to +125°C
Lead Temperature Range (Soldering, 10 sec) . . . . . . . . 300
°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150
°C
PIN CONFIGURATIONS
20-Lead SOIC, PDIP, and CERDIP
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
AD630
RINA
RINB
CH B+
CH B–
CH A–
CH A+
DIFF OFF ADJ
DIFF OFF ADJ
RB
RF
RA
CM OFF ADJ
CM OFF ADJ
–VS
SEL B
SEL A
+VS
COMP
VOUT
CHANNEL STATUS B/
A
20-Terminal CLCC
20 19
1
2
3
18
14
15
16
17
4
5
6
7
8
910 11 12 13
TOP VIEW
(Not to Scale)
AD630
DIFF OFF ADJ
CM OFF ADJ
CM OFF ADJ
CHANNEL STATUS B/A
–VS
CH B+
RINB
RA
RF
RB
ORDERING GUIDE
Model
Temperature Ranges
Package Description
Package Option
AD630JN
0
°C to 70°C
PDIP
N-20
AD630KN
0
°C to 70°C
PDIP
N-20
AD630AR
–25
°C to +85°C
SOIC
R-20
AD630AR-REEL
–25
°C to +85°CSOIC 13" Tape and Reel R-20
AD630AD
–25
°C to +85°C
SBDIP
D-20
AD630BD
–25
°C to +85°C
SBDIP
D-20
AD630SD
–55
°C to +125°C
SBDIP
D-20
AD630SD/883B
–55
°C to +125°C
SBDIP
D-20
5962-8980701RA
–55
°C to +125°C
SBDIP
D-20
AD630SE/883B
–55
°C to +125°C
CLCC
E-20A
5962-89807012A
–55
°C to +125°C
CLCC
E-20A
AD630JCHIPS
0
°C to 70°C
Chip
AD630SCHIPS
–55
°C to +125°C
Chip
CHIP METALLIZATION AND PINOUT
Dimensions shown in inches and (millimeters).
Contact factory for latest dimensions.
CHIP AVAILABILITY
The AD630 is available in laser trimmed, passivated chip
form. The figure above shows the AD630 metallization pattern,
bonding pads and dimensions. AD630 chips are available; con-
sult factory for details.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD630 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.


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