AD7823

–3–

REV. C

TIMING CHARACTERISTICS

1, 2

Parameter

10%

10%

Unit

Conditions/Comments

55

µs (max)

Conversion Time Mode 1 Operation (High Speed Mode)

20

20

ns (min)

CONVST Pulsewidth

25

25

ns (min)

SCLK High Pulsewidth

25

25

ns (min)

SCLK Low Pulsewidth

3

5

5

ns (min)

CONVST Rising Edge to SCLK Rising Edge Set-Up Time

3

10

10

ns (max)

3

5

5

ns (max)

Data Hold Time after Rising Edge SCLK

3, 4

20

20

ns (max)

Bus Relinquish Time after Falling Edge of SCLK

10

10

ns (min)

1.5

1.5

µs (max)

Power-Up Time

NOTES

± 10% and

± 10%.

of the part and as such is independent of external bus loading capacitances.

Specifications subject to change without notice.

(–40 C to +125 C, unless otherwise noted)

ABSOLUTE MAXIMUM RATINGS

*

°C unless otherwise noted)

Digital Input Voltage to GND

(

CONVST, SCLK) . . . . . . . . . . . . . . –0.3 V, V

Digital Output Voltage to GND

Analog Inputs

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . 260

°C

200mA

200 A

1.6V

50pF

TO

OUTPUT

PIN

Figure 1. Load Circuit for Digital Output Timing Specifications

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

MicroSOIC Package, Power Dissipation . . . . . . . . . . 450 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

Linearity

Temperature

Branding

Package

Model

Error

Range

Information

Option

*

AD7823YN

±1 LSB

–40

°C to +125°C

N-8

AD7823YR

±1 LSB

–40

°C to +125°C

SO-8

AD7823YRM

±1 LSB

–40

°C to +125°C

C2Y

RM-8

*N = plastic DIP; RM = microSOIC; SO = small outline IC (SOIC).