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LMZ35003RKGT Arkusz danych(PDF) 4 Page - Texas Instruments

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Numer części LMZ35003RKGT
Szczegółowy opis  2.5A SIMPLE SWITCHER짰 Power Module with 7V-50V Input in QFN Package
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Strona internetowa  http://www.ti.com
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PWRGD
VIN
PGND
PH
VOUT
RT/CLK
VADJ
STSEL
SS/TR
LMZ35003
PWRGD
Logic
+
+
VREF
Comp
Power
Stage
and
Control
Logic
Thermal Shutdown
Shutdown
Logic
OCP
VIN
UVLO
OSC w/PLL
AGND
INH/UVLO
LMZ35003
SNVS988 – JULY 2013
www.ti.com
THERMAL INFORMATION
LMZ35003
THERMAL METRIC(1)
RKG
UNIT
41 PINS
θJA
Junction-to-ambient thermal resistance(2)
14
ψJT
Junction-to-top characterization parameter(3)
3.3
°C/W
ψJB
Junction-to-board characterization parameter(4)
6.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance,
θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided, 4-layer PCB
with 1 oz. copper and natural convection cooling. Additional airflow reduces
θJA.
(3)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the device.
(4)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAM
4
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Product Folder Links: LMZ35003


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