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Specifications subject to change

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TS32101

Version 2.0

RECOMMEDED PCB LAND PATTERN

DIMENSIONS IN MILLIMETERS

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Contact Pitch

E

0.50 BSC

Optional Center Pad Width

W2

-

-

1.70

Optional Center Pad Length

T2

-

-

1.70

Contact Pad Spacing

C1

-

3.00

-

Contact Pad Spacing

C2

-

3.00

-

Contact Pad Width (X16)

X1

-

-

0.35

Contact Pad Length (X16)

Y1

-

-

0.65

Distance Between Pads

G

0.15

-

-

Notes:

Dimensions and tolerances per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact values shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information only.

PACAKGING INFORMATION

Pb-Free (RoHS): The TS30011/12/13 devices are fully compliant for all materials covered by European Union Directive 2002/95/EC, and meet all IPC-

1752 Level 3 materials declaration requirements.

MSL, Peak Temp: The TS30011/12/13 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices also have a Peak

Profile Solder Temperature (Tp) of 260°C.

RECOMMENDED

LAND PATTERN

Silk Screen