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ADS7263 Arkusz danych(PDF) 2 Page - Texas Instruments

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Numer części ADS7263
Szczegółowy opis  Dual, 1MSPS, 16-/14-/12-Bit, 4 2 or 2 2 Channel, Simultaneous Sampling Analog-to-Digital Converter
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

ADS7263 Arkusz danych(HTML) 2 Page - Texas Instruments

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ADS8363
ADS7263
ADS7223
SBAS523B – OCTOBER 2010 – REVISED JANUARY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder at www.ti.com.
FAMILY OVERVIEW
PRODUCT
RESOLUTION
NMC
INL
SNR
THD
ADS8363
16 bits
16 or 15 bits(1)
±3 or ±4 LSB(1)
93dB (typ)
–98dB (typ)
ADS7263
14 bits
14 bits
±1 LSB
85dB (typ)
–92dB (typ)
ADS7223
12 bits
12 bits
±0.5 LSB
73dB (typ)
–86dB (typ)
(1)
See Electrical Characteristics.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
ADS8363, ADS7263, ADS7223
UNIT
Supply voltage, AVDD to AGND or DVDD to DGND
–0.3 to +6
V
Supply voltage, DVDD to AVDD
1.2 × AVDD(2)
V
Analog and reference input voltage with respect to AGND
AGND – 0.3 to AVDD + 0.3
V
Digital input voltage with respect to DGND
DGND – 0.3 to DVDD + 0.3
V
Ground voltage difference |AGND-DGND|
0.3
V
Input current to any pin except supply pins
–10 to +10
mA
Maximum virtual junction temperature, TJ
+150
°C
Human body model (HBM),
±2000
V
Electrostatic
JEDEC standard 22, test method A114-C.01
discharge (ESD)
Charged device model (CDM),
ratings, all pins
±500
V
JEDEC standard 22, test method C101
(1)
Stresses above these ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied. Exposure to absolute maximum conditions for extended
periods may affect device reliability.
(2)
Exceeding the specified limit causes an increase of the DVDD leakage current and leads to malfunction of the device.
THERMAL INFORMATION
ADS8363,
ADS7263,
ADS7223
THERMAL METRIC(1)
UNITS
RHB
32 PINS
qJA
Junction-to-ambient thermal resistance
33.3
qJCtop
Junction-to-case (top) thermal resistance
29.5
qJB
Junction-to-board thermal resistance
7.3
°C/W
yJT
Junction-to-top characterization parameter
0.2
yJB
Junction-to-board characterization parameter
7.4
qJCbot
Junction-to-case (bottom) thermal resistance
0.9
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s): ADS8363 ADS7263 ADS7223


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