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LM2937ET-2.5 Arkusz danych(PDF) 2 Page - Texas Instruments |
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LM2937ET-2.5 Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 19 page LM2937-2.5, LM2937-3.3 SNVS015E – FEBRUARY 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Input Voltage Continuous 26V Transient (t ≤ 100 ms) 60V Internal Power Dissipation (3) Internally Limited Maximum Junction Temperature 150°C Storage Temperature Range −65°C to +150°C Lead Temperature Soldering TO-220 (10 seconds) 260°C DDPAK/TO-263 (10 seconds) 230°C SOT-223 (Vapor Phase, 60 seconds) 215°C SOT-223 (Infrared, 15 seconds) 220°C ESD Susceptibility (4) 2 kV (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its rated Operating Conditions. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the device junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application Hints for more information on heatsinking). (4) ESD rating is based on the human body model, 100 pF discharged through 1.5 k Ω. Operating Conditions (1) Temperature Range (2) LM2937ES, LM2937ET −40°C ≤ TA ≤ 125°C LM2937IMP −40°C ≤ TA ≤ 85°C Input Voltage Range 4.75V to 26V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its rated Operating Conditions. (2) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the device junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application Hints for more information on heatsinking). 2 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: LM2937-2.5 LM2937-3.3 |
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