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AD96687BPZ Arkusz danych(PDF) 2 Page - List of Unclassifed Manufacturers |
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AD96687BPZ Arkusz danych(HTML) 2 Page - List of Unclassifed Manufacturers |
2 / 11 page STANDARD MICROCIRCUIT DRAWING SIZE A 86008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86008 01 E X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function tPD±(at TA = +25°C) Min Max 01 685 Open-emitter output 4.5 6.5 ns 02 685 Open-emitter output 0.5 6.5 ns 03 6685 Open-emitter output 2.0 4.0 ns 04 96685 Open-emitter output 1.5 3.5 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line I MACY1-X10 10 Can 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Positive supply voltage (V+): Device types 01, 02, 03 ............................................................. +7 V dc Device type 04 ........................................................................... +6.5 V dc Negative supply voltage (V-): Device types 01, 02, 03 ............................................................. -7 V dc Device type 04 ........................................................................... -6.5 V dc Input voltage range (VI): Device types 01, 02, 03 ............................................................. ±4 V dc Device type 04 ........................................................................... ±5 V dc Differential input voltage (VID): Device types 01, 02, 03 ............................................................. ±6 V dc Device type 04 ........................................................................... ±5.5 V dc Storage temperature range .......................................................... -65 °C to +150°C Maximum power dissipation (PD): Device types 01, 02 ................................................................... 500 mW Device types 03, 04 ................................................................... 300 mW Lead temperature (soldering, 10 seconds) .................................... +300 °C Thermal resistance, junction-to-case ( θ JC) .................................... See MIL-STD-1835 Thermal resistance, junction-to-ambient ( θ JA): Case E ....................................................................................... 120 °C/W Case I ........................................................................................ 140 °C/W Case 2 ....................................................................................... 92.3 °C/W Output current ............................................................................... 30 mA |
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