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ADP2139CB-0.8EVALZ Arkusz danych(PDF) 4 Page - Analog Devices |
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ADP2139CB-0.8EVALZ Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 20 page ADP2138/ADP2139 Data Sheet Rev. C | Page 4 of 20 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN, EN, MODE −0.4 V to +6.5 V VOUT, SW to GND −1.0 V to (VIN + 0.2 V) Temperature Range Operating Ambient −40°C to +85°C Operating Junction −40°C to +125°C Storage Temperature −65°C to +150°C Lead Temperature Range −65°C to +150°C Soldering (10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C ESD Model Human Body ±1500 V Charged Device ±500 V Machine ±100 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. ADP2138/ADP2139 can be damaged when the junction tempera- ture limits are exceeded. Monitoring ambient temperature does not guarantee that the junction temperature (TJ) is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may need to be derated. In applications with mod- erate power dissipation and low printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit for as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula TJ = TA + (PD × θJA) Junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 in. × 3 in., circuit board. Refer to JEDEC JESD 51-9 for detailed information pertaining to board construction. For additional information, see AN-617 Application Note, MicroCSPTM Wafer Level Chip Scale Package. ΨJB is the junction-to-board thermal characterization parameter measured in units of °C/W. ΨJB of the package is based on modeling and calculation using a 4-layer board. The JESD51-12, Guidelines for Reporting and Using Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths rather than through a single path, which is the procedure for measuring thermal resistance, θJB. There- fore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package; factors that make ΨJB more useful in real-world applications than θJB. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD × ΨJB) Refer to JEDEC JESD51-8 and JESD51-12 for more detailed information about ΨJB. THERMAL RESISTANCE θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA ΨJB Unit 6-Ball WLCSP 170 80 °C/W ESD CAUTION |
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