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AD780BR-REEL Arkusz danych(PDF) 4 Page - Analog Devices |
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AD780BR-REEL Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 12 page AD780 Data Sheet Rev. F | Page 4 of 12 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Values +VIN to Ground 36 V TRIM Pin to Ground 36 V TEMP Pin to Ground 36 V Power Dissipation (25°C) 500 mW Storage Temperature −65°C to +150°C Lead Temperature (Soldering 10 sec) 300°C Output Protection Output safe for indefinite short to ground and momentary short to VIN. ESD Classification Class 1 (1000 V) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum specifications for extended periods may affect device reliability. NC = NO CONNECT AD780 TOP VIEW (Not to Scale) NC 1 +VIN 2 TEMP 3 GND 4 2.5V/3.0V O/PSELECT (NC OR GND) NC VOUT TRIM 8 7 6 5 Figure 2. Pin Configuration, 8-Lead PDIP and SOIC Packages GND TEMP +VIN TRIM 2.5V/3.0V O/P SELECT VOUT GND Figure 3. Die Layout NOTES Both VOUT pads should be connected to the output. Die Thickness: The standard thickness of Analog Devices bipolar dice is 24 mil ± 2 mil. Die Dimensions: The dimensions given have a tolerance of ±2 mil. Backing: The standard backside surface is silicon (not plated). Analog Devices does not recommend gold-backed dice for most applications. Edges: A diamond saw is used to separate wafers into dice, thus providing perpendicular edges halfway through the die. In contrast to scribed dice, this technique provides a more uniform die shape and size. The perpendicular edges facilitate handling (such as tweezer pickup), while the uniform shape and size simplify substrate design and die attach. Top Surface: The standard top surface of the die is covered by a layer of glassivation. All areas are covered except bonding pads and scribe lines. Surface Metallization: The metallization to Analog Devices bipolar dice is aluminum. Minimum thickness is 10,000 Å. Bonding Pads: All bonding pads have a minimum size of 4.0 mil by 6.0 mil. The passivation windows have a minimum size of 3.6 mil by 5.6 mil. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
Podobny numer części - AD780BR-REEL |
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Podobny opis - AD780BR-REEL |
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