Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com

Page 4 of 4

January 2008

ECG003

InGaP HBT Gain Block

ECG003B-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260

°C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.

Outline Drawing

Land Pattern

Product Marking

The component will be marked with an

“E003G” designator with an alphanumeric lot

code on the top surface of the package. The

obsolete tin-lead package is marked with an

“E003”

designator

followed

by

an

alphanumeric lot code; it may also have been

marked with an “8” designator followed by a

3-digit numeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1A

Value:

Passes between 250 and 500V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260

°C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance of

this device. Vias should use a .35mm (#80 / .0135”) diameter

drill and have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near

the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board

to a heatsink.

Ensure that the ground / thermal via region

contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

E003G

XXXX-X