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ADS1231 Arkusz danych(PDF) 2 Page - Texas Instruments |
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ADS1231 Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 23 page ADS1231 SBAS414C – JULY 2009 – REVISED DECEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. ADS1231 UNIT AVDD to GND –0.3 to +6 V DVDD to GND –0.3 to +6 V 100, momentary mA Input current 10, continuous mA Analog input voltage to GND –0.3 to AVDD + 0.3 V Digital input voltage to GND –0.3 to DVDD + 0.3 V Human body model (HBM) ±2000 V JEDEC standard 22, test method A114-C.01, all pins ESD(2) Charged device model (CDM) ±500 V JEDEC standard 22, test method C101, all pins Maximum junction temperature +150 °C Operating temperature range –40 to +85 °C Storage temperature range –60 to +150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage. THERMAL INFORMATION ADS1231 THERMAL METRIC(1) SOIC (D) UNITS 16 PINS qJA Junction-to-ambient thermal resistance 79.5 qJCtop Junction-to-case (top) thermal resistance 37.5 qJB Junction-to-board thermal resistance 37.1 °C/W yJT Junction-to-top characterization parameter 5.6 yJB Junction-to-board characterization parameter 36.7 qJCbot Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated |
Podobny numer części - ADS1231_14 |
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Podobny opis - ADS1231_14 |
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