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DAC34H84 Arkusz danych(PDF) 7 Page - Texas Instruments

Numer części DAC34H84
Szczegółowy opis  Quad-Channel, 16-Bit, 1.25 GSPS Digital-to-Analog Converter (DAC)
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
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DAC34H84 Arkusz danych(HTML) 7 Page - Texas Instruments

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DAC34H84
www.ti.com
SLAS751B
– MARCH 2011 – REVISED SEPTEMBER 2011
THERMAL INFORMATION
DAC34H84
THERMAL METRIC(1)
BGA
UNITS
(196 ball) PINS
TJ
Maximum junction temperature
125
°C
θJA
Junction-to-ambient thermal resistance(2)
37.6
θJCtop
Junction-to-case (top) thermal resistance(3)
6.8
θJCbot
Junction-to-case (bottom) thermal resistance(4)
N/A
°C/W
θJB
Junction-to-board thermal resistance(5)
16.8
ψJT
Junction-to-top characterization parameter(6)
0.2
ψJB
Junction-to-board characterization parameter(7)
16.4
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(5)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(6)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
Copyright
© 2011, Texas Instruments Incorporated
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