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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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DAC3283 Arkusz danych(PDF) 5 Page - Texas Instruments |
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DAC3283 Arkusz danych(HTML) 5 Page - Texas Instruments |
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5 / 63 page  DAC3283 www.ti.com SLAS693B – MARCH 2010 – REVISED JUNE 2012 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT DACDVDD18(2) –0.5 to 2.3 V DIGVDD18(2) –0.5 to 2.3 V Supply voltage range CLKVDD18(2) –0.5 to 2.3 V VFUSE(2) –0.5 to 2.3 V AVDD33(2) –0.5 to 4 V CLKVDD18 to DIGDVDD18 –0.5 to 0.5 V DACVDD18 TO DIGVDD18 –0.5 to 0.5 V D[7..0]P ,D[7..0]N, DATACLKP, DATACLKN, FRAMEP, FRAMEN(2) –0.5 to DIGVDD18 + 0.5 V Terminal voltage DACCLKP, DACCLKN, OSTRP, OSTRN(2) –0.5 to CLKVDD18 + 0.5 V range ALARM_SDO, SDIO, SCLK, SDENB, TXENABLE(2) –0.5 to DIGCLKVDD18 + 0.5 V IOUTA1/B1, IOUTA2/B2(2) –1.0 to AVDD33 + 0.5 V EXTIO, BIASJ(2) –0.5 to AVDD33 + 0.5 V Peak input current (any input) 20 mA Peak total input current (all inputs) –30 mA Operating free-air temperature range, TA: DAC3283 –40 to 85 °C Storage temperature range –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Measured with respect to GND. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) THERMAL CONDUCTIVITY 48ld QFN UNIT TJ Maximum junction temperature (1) (2) 125 °C Theta junction-to-ambient (still air) 30 θJA °C/W Theta junction-to-ambient (150 lfm) 24 θJB Theta junction-to-board 8 °C/W θJp Theta junction-to-pad 1.3 °C/W (1) Air flow or heat sinking reduces θJA and may be required for sustained operation at 85° under maximum operating conditions. (2) It is strongly recommended to solder the device thermal pad to the board ground plane. Copyright © 2010–2012, Texas Instruments Incorporated 5 |
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