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TPD2E001-Q1 Arkusz danych(PDF) 3 Page - Texas Instruments |
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TPD2E001-Q1 Arkusz danych(HTML) 3 Page - Texas Instruments |
3 / 12 page TPD2E001-Q1 www.ti.com SLLS993 – NOVEMBER 2009 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC –0.3 7 V VIO –0.3 VCC + 0.3 V Tstg Storage temperature range –65 150 °C TJ Junction temperature 150 °C Infrared (15 s) 220 Bump temperature (soldering) °C Vapor phase (60 s) 215 Lead temperature (soldering, 10 s) 300 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute-maximum-rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS VCC = 5 V ± 10%, TA = -40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT VCC Supply voltage 0.9 5.5 V ICC Supply current 1 120 nA VF Diode forward voltage IF = 10 mA 0.65 0.95 V VBR Breakdown Voltage IBR = 10mA 11 V Positive transients VCC + 25 TA = 25°C, ±15-kV HBM, IF = 10 A Negative transients –25 TA = 25°C, Positive transients VCC + 60 ±8-kV Contact Discharge VC Channel clamp voltage(2) V Negative transients –60 (IEC 61000-4-2), IF = 24 A TA = 25°C, Positive transients VCC + 100 ±15-kV Air-Gap Discharge Negative transients –100 (IEC 61000-4-2), IF = 45 A Ii/o Channel leakage current(2) Vi/o = GND to VCC ±1 nA Ci/o Channel input capacitance VCC = 5 V, Bias of VCC/2 1.5 pF (1) Typical values are at VCC = 5 V and TA = 25°C (2) Not production tested ESD PROTECTION PARAMETER TYP UNIT HBM ±15 kV IEC 61000-4-2 Contact Discharge ±8 kV IEC 61000-4-2 Air-Gap Discharge ±15 kV Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TPD2E001-Q1 |
Podobny numer części - TPD2E001-Q1_14 |
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Podobny opis - TPD2E001-Q1_14 |
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