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LM3686 Arkusz danych(PDF) 5 Page - Texas Instruments |
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LM3686 Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 28 page LM3686 www.ti.com SNVS520D – AUGUST 2008 – REVISED MARCH 2011 Absolute Maximum Ratings (1) (2) VBATT pin to GND and QGND -0.2V to 6.0V Enable pins, (GND-0.2V) to Feedback pins, (VBATT+0.2V) with SW pin 6.0V max Junction Temperature (TJ-MAX ) 150°C Storage Temperature Range -65°C to + 150°C Continuous Power Dissipation(3) Internally Limited Maximum Lead Temperature (4) (Soldering) (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 130°C (typ.). (4) For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level Chip Scale Package (AN-1112) Operating Ratings Input Voltage Range VBATT 2.7V to 5.5V (DC-DC & LDO) Junction Temperature (TJ) Range -40°C to + 125°C Ambient Temperature (TA) Range -40°C to + 85°C (1) (1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). Thermal Properties Junction-to-Ambient Thermal Resistance ( θJA) (1) Micro SMD 12 120°C/W (1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special attention must be paid to thermal dissipation issues in board design. Copyright © 2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM3686 |
Podobny numer części - LM3686_14 |
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Podobny opis - LM3686_14 |
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