PIN ASSIGNMENTS

CHA+

CHA-

CHB+

CHB-

CHC-

CHC+

CHD-

CHD+

OUTA

OUTB

OUTC

OUTD

CLKOUT

BGND

BV

DD

CLKIN

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

ADS1204

ADS1204

RHB PACKAGE(1)

QFN-32

(TOP VIEW)

(1) The thermal pad is internally connected to the substrate. This pad can be connected to the analog ground or left floating. Keep the

thermal pad separate from the digital ground, if possible.

TERMINAL FUNCTIONS

TERMINAL

NAME

NO.

DESCRIPTION

CH A+

1

AI

Analog input of channel A: noninverting input

CH A–

2

AI

Analog input of channel A: inverting input

CH B+

3

AI

Analog input of channel B: noninverting input

CH B–

4

AI

Analog input of channel B: inverting input

CH C–

5

AI

Analog input of channel C: inverting input

CH C+

6

AI

Analog input of channel C: noninverting input

CH D–

7

AI

Analog input of channel D: inverting input

CH D+

8

AI

Analog input of channel D: noninverting input

REFIN D

9

AI

Reference voltage input of channel D: pin for external reference voltage

REFIN C

10

AI

Reference voltage input of channel C: pin for external reference voltage

AGND

11

—

Analog ground

AVDD

12

P

Analog power supply; nominal 5V

NC

13

—

No connection; this pin is left unconnected

14

P

Analog power supply; nominal 5V

AGND

15

—

Analog ground

CLKSEL

16

I

Clock select between internal clock (CLKSEL = 1) or external clock (CLKSEL = 0)

CLKIN

17

I

External clock input

18

P

Digital interface power supply; from 2.7V to 5.5V

BGND

19

—

Interface ground

CLKOUT

20

O

System clock output

(1)

AI = Analog Input; AO = Analog Output; I = Input; O = Output; P = Power Supply.

6

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