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ADS7949SRTET Arkusz danych(PDF) 2 Page - Texas Instruments

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Numer części ADS7949SRTET
Szczegółowy opis  12/10/8-Bit, 2MSPS, Dual-Channel, Unipolar, Pseudo-Differential, Ultralow-Power SAR Analog-to-Digital Converters
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

ADS7949SRTET Arkusz danych(HTML) 2 Page - Texas Instruments

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ADS7947
ADS7948
ADS7949
SLAS708 – SEPTEMBER 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FAMILY AND ORDERING INFORMATION(1)
PRODUCT
RESOLUTION (Bits)
INPUT
SAMPLE RATE (MSPS)
ADS7947
12
Unipolar, pseudo-differential
2
ADS7948
10
Unipolar, pseudo-differential
2
ADS7949
8
Unipolar, pseudo-differential
2
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
ADS7947, ADS7948, ADS7949
MIN
MAX
UNIT
AINxP to GND or AINxN to GND
–0.3
AVDD + 0.3
V
AVDD to GND or DVDD to GND
–0.3
+7
V
Digital input voltage to GND
–0.3
DVDD + 0.3
V
Digital output to GND
–0.3
DVDD + 0.3
V
Operating temperature range
–40
+125
°C
Storage temperature range
–65
+150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under electrical characteristics is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
ADS7947/48/49
THERMAL METRIC(1)
RTE
UNITS
16 PINS
qJA
Junction-to-ambient thermal resistance
54.3
qJCtop
Junction-to-case (top) thermal resistance
53.7
qJB
Junction-to-board thermal resistance
19.2
°C/W
yJT
Junction-to-top characterization parameter
0.3
yJB
Junction-to-board characterization parameter
14.5
qJCbot
Junction-to-case (bottom) thermal resistance
5.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): ADS7947 ADS7948 ADS7949


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