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CD4069UBMS Arkusz danych(PDF) 5 Page - Intersil Corporation

Numer części CD4069UBMS
Szczegółowy opis  CMOS Hex Inverter
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Producent  INTERSIL [Intersil Corporation]
Strona internetowa  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

CD4069UBMS Arkusz danych(HTML) 5 Page - Intersil Corporation

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All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Specifications CD4069UBMS
Group B
Subgroup B-5
Sample 5005
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6
Sample 5005
1, 7, 9
Group D
Sample 5005
1, 2, 3, 8A, 8B, 9
Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE GROUPS
MIL-STD-883
METHOD
TEST
READ AND RECORD
PRE-IRRAD
POST-IRRAD
PRE-IRRAD
POST-IRRAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
1, 9
Table 4
TABLE 8. BURN-IN AND IRRADIATION TEST CONNECTIONS
FUNCTION
OPEN
GROUND
VDD
9V
± -0.5V
OSCILLATOR
50kHz
25kHz
Static Burn-In 1
(Note 1)
2, 4, 6, 8, 10, 12
1, 3, 5, 7, 9, 11,
13
14
Static Burn-In 2
(Note 1)
2, 4, 6, 8, 10, 12
7
1, 3, 5, 9, 11, 13,
14
Dynamic Burn-In
(Note 1)
-
7
14
2, 4, 6, 8, 10, 12
1, 3, 5, 9, 11, 13
Irradiation
(Note 2)
2, 4, 6, 8, 10, 12
7
1, 3, 5, 9, 11, 13,
14
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K
± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K
± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V
± 0.5V
Typical Performance Characteristics
FIGURE 2. MINIMUM AND MAXIMUM VOLTAGE TRANSFER
CHARACTERISTICS
FIGURE 3. TYPICAL VOLTAGE TRANSFER CHARACTERIS-
TICS AS A FUNCTION OF TEMPERATURE
TABLE 6. APPLICABLE SUBGROUPS
(Continued)
CONFORMANCE GROUP
MIL-STD-883
METHOD
GROUP A SUBGROUPS
READ AND RECORD
AMBIENT TEMPERATURE (TA) = +25
oC
VI
VO
SUPPLY VOLTAGE
(VDD) = 15V
10V
5V
15.0
12.5
10.0
7.5
5.0
2.5
0
2.5
5.0
7.5
10.0
12.5
15.0
INPUT VOLTAGE (VI) (V)
SUPPLY VOLTAGE
(VDD) = 15V
10V
5V
15.0
12.5
10.0
7.5
5.0
2.5
0
2.5
5.0
7.5
10.0
12.5
15.0
INPUT VOLTAGE (VI) (V)
17.5
17.5
20.0
-55oC
-55oC
-55oC
+125oC
AMBIENT TEMPERATURE (TA)
= +125oC


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