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AD8187 Arkusz danych(PDF) 4 Page - Analog Devices |
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AD8187 Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 20 page REV. A –4– AD8186/AD8187 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8186/AD8187 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS 1, 2, 3, 4 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V DVCC to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V DVCC to VEE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0 V VCC to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0 V IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, VREF . . . VEE ≤ V IN ≤ V CC SEL A/ B, OE . . . . . . . . . . . . . . . . . . . . . . D GND ≤ VIN ≤ DVCC Output Short Circuit Operation . . . . . . . . . . . . . . . Indefinite Storage Temperature Range . . . . . . . . . . . . –65ºC to +150ºC Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300ºC NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the Theory of Operation section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 Specification is for device in free air (T A = 25ºC). 3 24-lead TSSOP; T JA= 85ºC/W. Maximum internal power dissipation (PD) should be derated for ambient temperature (TA) such that PD < (150ºC TA)/TJA. 4 T JA of 85 C/W is on a 4-layer board (2s 2p). MAXIMUM POWER DISSIPATION The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150ºC. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175ºC for an extended period can result in device failure. While the AD8186/AD8187 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (150ºC) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figure 2. PIN CONFIGURATION IN0A DGND VREF OUT 0 OUT 1 OUT 2 IN1A IN2A IN2B IN1B IN0B VCC VEE VEE VEE VCC OE SEL A/ B VEE VCC VCC VCC VEE DVCC 24 23 22 21 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 9 10 11 12 AD8186/ AD8187 TOP VIEW (Not to Scale) AMBIENT TEMPERATURE ( C) –50 –40 1.0 0.5 1.5 0 2.0 2.5 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 Figure 2. Maximum Power Dissipation vs. Temperature ORDERING GUIDE Model Temperature Range Package Description Package Option AD8186ARU –40ºC to +85ºC 24-Lead Thin Shrink Small Outline Package (TSSOP) RU-24 AD8186ARU-REEL –40ºC to +85ºC 13 " Reel TSSOP RU-24 AD8186ARU-REEL 7 –40ºC to +85ºC 7 " Reel TSSOP RU-24 AD8187ARU –40ºC to +85ºC 24-Lead Thin Shrink Small Outline Package (TSSOP) RU-24 AD8187ARU-REEL –40ºC to +85ºC 13 " Reel TSSOP RU-24 AD8187ARU-REEL 7 –40ºC to +85ºC 7 " Reel TSSOP RU-24 AD8186-EVAL Evaluation Board AD8187-EVAL Evaluation Board |
Podobny numer części - AD8187_15 |
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Podobny opis - AD8187_15 |
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