TPL5110 datasheet(4/26 Pages) TI1

Numer części	TPL5110

Szczegółowy opis	Supply Voltage from 1.8V to 5.5V

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Producent	TI1 [Texas Instruments]

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TPL5110

SNAS650 – JANUARY 2015 – REVISED JANUARY 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply Voltage (VDD-GND)

-0.3

6.0

V

Input Voltage at any pin(2)

-0.3

VDD + 0.3

V

Input Current on any pin

-5

+5

mA

Storage Temperature, Tstg

-65

150

°C

Junction Temperature, TJ(3)

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The voltage between any two pins should not exceed 6V.

(3)

The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC

board.

7.2 ESD Ratings

VALUE

UNIT

Human Body Model, per ANSI/ESDA/JEDEC JS-001(1)

±1000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-101(2)

±250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Ratings

MIN

MAX

UNIT

Supply Voltage (VDD-GND)

1.8

5.5

V

Temperature Range

-40

105

°C

7.4 Thermal Information

TPL5110

THERMAL METRIC(1)

SOT23

UNIT

6 PINS

RθJA

Junction-to-ambient thermal resistance

163

RθJC(top)

Junction-to-case (top) thermal resistance

26

RθJB

Junction-to-board thermal resistance

57

°C/W

ψJT

Junction-to-top characterization parameter

7.5

ψJB

Junction-to-board characterization parameter

57

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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