1.2 W High Efficiency Power Amplifier

AM52-0001

V1.00

Specifications Subject to Change Without Notice.

2

M/A-COM Inc.

North America: Tel. (800) 366-2266

♦ Asia/Pacific: Tel. +81 3 3226-8761

♦

Europe:

Tel. +44 (1344) 869-595

Fax (800) 618-8883

Fax +81 3 3226-8769

Fax +44 (1344) 300 020

Absolute Maximum Ratings

1

Parameter

Absolute Maximum

Input Power

2

+23 dBm

Operating Voltage

2

Junction Temperature

3

+150

°C

Storage Temperature

-65

°C to +150 °C

Operating Temperature

-40

°C to +85 °C

1. Exceeding any one or combination of these limits may cause

permanent damage.

°C

3. See temperature derating curve.

Pin Configuration

Pin No.

Pin Name

Description

Negative supply voltage, First stage

2

RF IN

RF Input of the amplifier

3

GND

DC and RF Ground

Positive supply voltage, First stage

Negative supply voltage, First stage

6

GND

DC and RF Ground

7

RF OUT

RF Output of the amplifier

Positive supply voltage, Second stage

9

Puck

DC and RF Ground

Recommended PCB Configuration

Layout View (AMPS 824-849 MHz)

0.47" (T1)

0.25" (T2)

C9

C8

C1

C6

C10

C3

C7

C11

C2

C4

C5

Functional Block Diagram

(AMPS 824-849 MHz)

1

2

4

3

8

7

5

6

C1

C2

C3

C4

C5

C6

C7

C8

C9

C1 1

RF O U T

RF IN

VD1

VD2

VG 2

VG 1

C1 0

T1

T2

9

External Circuitry Parts List

(AMPS 824-849 MHz)

Part

Value

Purpose

C1 - C3

220 pF

By-Pass

C4 - C7

0.1 uF

By-Pass

C8

8 pF

Power Tuning

C9, C10

56 pF

DC Block

C11

1.0 uF

By-Pass

T1

0.470”

Matching Transmission

T2

0.250”

Lines (50

Ω)

1.) The recommended layout is specifically for the AMPS application. It

shows EIA code size 0603 standard SMT capacitors with the exception of

C11 which is a EIA code size 3528

2.) The location of C9, C10 and C11 is not critical to the performance of

the amplifier.

Cross Section View

RF Traces + Components

RF Ground

DC Routing

Customer Defined

The PCB dielectric between RF traces and RF ground layers should

be chosen to reduce RF discontinuities between 50

Ω lines and

package pins. M/A-COM recommends an FR-4 dielectric thickness

of 0.008”(0.2 mm) yielding a 50

Ω line width of 0.015”(0.38 mm).

The recommended metalization thickness is 1 oz. copper and ground

metalization thickness is 2 oz..

Shaded traces are vias to DC

Routing layer and traces on DC Routing layer.

Biasing Procedure

followed. All FETs in the PA will draw IDSS and damage internal

performance.