V2.00

Switched Low Noise Amplifier, 800-1000 MHz

AM55-0016

M/A-COM Division of AMP Incorporated s North America: Tel. (800) 366-2266, Fax (800) 618-8883 s Asia/Pacific: Tel.+85 2 2111 8088, Fax +85 2 2111 8087

s Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020

www.macom.com

AMP and Connecting at a Higher Level are trademarks.

Specifications subject to change without notice.

L1

RFOUT

RFIN

VDD

VCTL

RBIAS

C1

C2

C6

C4

C3

C5

C7

U1

1

2

3

45

6

7

8

RF Traces + Components

RF Ground

DC Routing

Customer Defined

The PCB dielectric between RF traces and RF ground layers

should be chosen to reduce RF discontinuities between 50

Ω

lines and package pins.

M/A-COM recommends an FR-4

dielectric thickness of 0.008” (0.2 mm) yielding a 50

Ω line

width of 0.015” (0.38 mm).

The recommended metalization

thickness is 1 ounce copper.

U2

C2

C4

C6

C7

C5

C3

L1

C1

U1

RBIAS

External Circuitry Parts List

1

Part

Value

Purpose

C1, C2

1000 pF

Source Bypass

C3, C4

47 pF

By-Pass

C5, C6, C7

10 nF

By-Pass

L1

22 nH

Tuning

RBIAS

see note 2

Source Bias Resistor

U1

UMH9N

Dual Bipolar Transistor

1. All external circuitry parts are readily available, low cost surface

mount components (0.040 inches x 0.020 inches or 0.060 inches x

0.030 inches).

2. RBIAS is chosen to set the desired current,

For:

I

I

I

Layout View

Absolute Maximum Ratings

1

Parameter

Absolute Maximum

V

DD

+6 VDC

Input Power

0 dBm

Current

30 mA

Channel Temperature

2

+150°C

Operating Temperature

-40°C to +85°C

Storage Temperature

-65°C to +150°C

1. Exceeding any one or combination of these limits may cause

permanent damage.

2. Typical thermal resistance (

θ

Pin Configuration

External Circuitry

Cross Section View

Recommended PCB Configuration

Pin No.

Pin Name

Description

1

VDD1

Stage 1 Supply Voltage

2

IN

RF Input

3

VS1

Stage 1 Source

4

GND

RF and DC Ground

5

VS2

Stage 2 Source

6

OUT

RF Output

7

VDD2

Stage 2 Supply Voltage

8

VCTL

Switch Control Voltage