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BD1LB500FVM-C Arkusz danych(PDF) 3 Page - Rohm |
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BD1LB500FVM-C Arkusz danych(HTML) 3 Page - Rohm |
3 / 19 page Datasheet Datasheet 3/16 BD1LB500 Series TSZ02201-0G3G0BD00040-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 2015.04.01 Rev.006 www.rohm.co.jp TSZ22111・15・001 Absolute Maximum Ratings Item Symbol Limit values Unit DRAIN-SOURCE voltage VDS 42 (internally limited) V Power supply voltage VDD 7 V Diagnostic output voltage VST -0.3 to +7 (1) V Output current (DC) IOD 0.8 (2) A Output current (Pulse) IOP Internally limited (3) A Input voltage VIN -0.3 to +7 (1) V Power consumption Pd 2.1(HTSOP-J8) (4) W 0.587(MSOP8) (5) Operating temperature range Topr -40≤Topr<+150 °C Storage temperature range Tstg -55 to +150 °C Maximum junction temperature Tjmax 150 °C Active clamp energy (single pulse) EAS 25 (6) mJ Operating Voltage Ratings Item Code Limit values Unit Operating voltage range VDD 3.5 to 5.5 V (1) The condition, VDD>VIN, VST is required. (2) The value must not exceed Pd. (3) Internally limited by the overcurrent limiting circuit. (4) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate). When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C. (5) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy single-layer substrate). When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C. (6) Min Active clamp energy at Tj(0) = 25°C, using single non-repetitive pulse of 0.4A Heat Dissipation Characteristics (HTSOP-J8) (1) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 4-layer substrate) When using at Ta ≥ 25°C, power dissipation is reduced at 30mW/°C. (2) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy 2-layer substrate) When using at Ta ≥ 25°C, power dissipation is reduced at 16.8mW/°C. (MSOP8) (3) When mounting PCB (70×70[mm], thickness 1.6[mm], copper foil area 70×70[mm], glass epoxy single-layer substrate) When using at Ta ≥ 25°C, power dissipation is reduced at 4.7mW/°C. 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 0 25 50 75 100 125 150 Ta [℃] 0.587 W 2.1 W 3.75 W HTSOP-J8 (1) HTSOP-J8 (2) MSOP8 (3) |
Podobny numer części - BD1LB500FVM-C |
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Podobny opis - BD1LB500FVM-C |
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