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September 24, 2014

IRL6283MTRPbF

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 

Absolute Maximum Ratings

Parameter

Max.

Units

Power Dissipation 

2.1

W

Power Dissipation 

1.3

Power Dissipation 

63

Peak Soldering Temperature

270

°C

Operating Junction and

-40 to + 150

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Ambient 

–––

60

Junction-to-Case 

–––

1.97

Junction-to-PCB Mounted

1.0

–––

Linear Derating Factor 

0.02

W/°C

Junction-to-Ambient 

12.5

–––

Junction-to-Ambient 

20

–––

°C/W

1E-006

1E-005

0.0001

0.001

0.01

0.1

1

10

100

1000

t1 , Rectangular Pulse Duration (sec)

0.0001

0.001

0.01

0.1

1

10

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc



Surface mounted on 1 in. square Cu board, steady state.







Used double sided cooling , mounting pad with large heat sink.



Mounted on minimum footprint full size board with metalized

back and with small clip heat sink.

