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74CBTLV3245 Arkusz danych(PDF) 3 Page - NXP Semiconductors |
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74CBTLV3245 Arkusz danych(HTML) 3 Page - NXP Semiconductors |
3 / 18 page 74CBTLV3245 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 15 December 2011 3 of 18 NXP Semiconductors 74CBTLV3245 8-bit bus switch with output enable 5. Pinning information 5.1 Pinning Fig 3. Pin configuration for TSSOP20 (SOT360-1) Fig 4. Pin configuration for SSOP20 (SOT724-1) 74CBTLV3245 n.c. VCC A1 OE A2 B1 A3 B2 A4 B3 A5 B4 A6 B5 A7 B6 A8 B7 GND B8 001aan325 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 74CBTLV3245 n.c. VCC A1 OE A2 B1 A3 B2 A4 B3 A5 B4 A6 B5 A7 B6 A8 B7 GND B8 001aan326 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 5. Pin configuration for DHVQFN20 (SOT764-1) 001aan327 74CBTLV3245 Transparent top view B7 A7 A8 B6 A6 B5 A5 B4 A4 B3 A3 B2 A2 B1 A1 GND(1) OE 9 12 8 13 7 14 6 15 5 16 4 17 3 18 2 19 terminal 1 index area |
Podobny numer części - 74CBTLV3245_15 |
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Podobny opis - 74CBTLV3245_15 |
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