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UC1825-DIE Arkusz danych(PDF) 1 Page - Texas Instruments |
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UC1825-DIE Arkusz danych(HTML) 1 Page - Texas Instruments |
1 / 5 page UC1825-DIE www.ti.com SLUSBO1 – JULY 2013 RAD-TOLERANT, HIGH-SPEED PWM CONTROLLER Check for Samples: UC1825-DIE 1 FEATURES • Rad-Tolerant: 30 kRad (Si) TID (1) • Wide Bandwidth Error Amplifier • Compatible With Voltage- or Current-Mode • Fully Latched Logic With Double-Pulse Topologies Suppression • Practical Operation Switching Frequencies • Pulse-by-Pulse Current Limiting • 50-ns Propagation Delay-to-Output • Soft Start/Maximum Duty-Cycle Control • High-Current Dual Totem Pole Outputs • Undervoltage Lockout With Hysteresis (1) Radiation tolerance is a typical value based upon initial device • Low Start-Up Current qualification with dose rate = 10 mrad/sec. Radiation Lot Acceptance Testing is available - contact factory for details. DESCRIPTION The UC1825-DIE PWM control device is optimized for high-frequency switched mode power supply applications. Particular care was given to minimizing propagation delays through the comparators and logic circuitry while maximizing bandwidth and slew rate of the error amplifier. This controller is designed for use in either current- mode or voltage mode systems with the capability for input voltage feed-forward. Protection circuitry includes a current limit comparator with a 1-V threshold, a TTL compatible shutdown port, and a soft start pin which will double as a maximum duty-cycle clamp. The logic is fully latched to provide jitter-free operation and prohibit multiple pulses at an output. An undervoltage lockout section with 800 mV of hysteresis assures low start up current. During undervoltage lockout, the outputs are high impedance. This device features totem pole outputs designed to source and sink high peak currents from capacitive loads, such as the gate of a power MOSFET. The on state is designed as a high level. ORDERING INFORMATION(1) PACKAGE PRODUCT PACKAGE ORDERABLE PART NUMBER PACKAGE QUANTITY DESIGNATOR UC1825VTD1 88 UC1825 TD Bare die in waffle pack(2) UC1825VTD2 10 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
Podobny numer części - UC1825-DIE_15 |
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Podobny opis - UC1825-DIE_15 |
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