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TPA2006D1 Arkusz danych(PDF) 4 Page - Texas Instruments |
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TPA2006D1 Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 32 page TPA2006D1 SLOS498B – SEPTEMBER 2006 – REVISED SEPTEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT In active mode –0.3 6 V VDD Supply voltage In SHUTDOWN mode –0.3 7 V VI Input voltage –0.3 VDD + 0.3 Ω 2.5 ≤ VDD ≤ 4.2 V 3.2 RL Load resistance Ω 4.2 < VDD ≤ 6 V 6.4 TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply voltage 2.5 5.5 V VIH High-level input voltage SHUTDOWN 1.3 VDD V VIL Low-level input voltage SHUTDOWN 0 0.35 V RI Input resistor Gain ≤ 20 V/V (26 dB) 15 k Ω VIC Common mode input voltage range VDD = 2.5 V, 5.5 V, CMRR ≤ –49 dB 0.5 VDD–0.8 V TA Operating free-air temperature –40 85 °C 7.4 Thermal Information TPA2006D1 THERMAL METRIC(1) VSON (DRB) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 50.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 66.2 °C/W RθJB Junction-to-board thermal resistance 25.9 °C/W ψJT Junction-to-top characterization parameter 1.4 °C/W ψJB Junction-to-board characterization parameter 26 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TPA2006D1 |
Podobny numer części - TPA2006D1_15 |
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Podobny opis - TPA2006D1_15 |
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