ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

DISSIPATION RATINGS

TPA6205A1

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

MicroStar Junior™

QFN

MSOP

(ZQV)

(DRB)

(DGN)

Device

TPA6205A1ZQVR

TPA6205A1DRB

TPA6205A1DGN

Symbolization

AANI

AAOI

AAPI

(1)

The ZQV packages are only available taped and reeled. The suffix R designates taped and reeled parts.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

over operating free-air temperature range unless otherwise noted

(1)

UNIT

Supply voltage

–0.3 V to 6 V

Input voltage

INx and SHUTDOWN pins

Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature

–40°C to 85°C

Junction temperature

–40°C to 125°C

Storage temperature

–65°C to 150°C

Lead temperature 1,6 mm (1/16 Inch)

ZQV, DRB, DGN

260°C

from case for 10 seconds

(1)

Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

MIN

TYP

MAX

UNIT

Supply voltage

2.5

5.5

V

High-level input voltage

SHUTDOWN

1.15

V

Low-level input voltage

SHUTDOWN

0.50

V

Common-mode input voltage

0.5

V

Operating free-air temperature

–40

85

°C

Load impedance

6.4

8

Ω

PACKAGE

DERATING FACTOR

POWER RATING

POWER RATING

POWER RATING

ZQV

885 mW

8.8 mW/°C

486 mW

354 mW

DGN

2.13 W

17.1 mW/°C

1.36 W

1.11 W

DRB

2.7 W

21.8 mW/°C

1.7 W

1.4 W

2

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