LM2622

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SNVS068E – MAY 2000 – REVISED MARCH 2013

Electrical Characteristics (continued)

Min

Typ

Max

Symbol

Parameter

Conditions

Units

(1)

(2)

(1)

Input Voltage Range

2

12

V

Error Amp Transconductance

ΔI = 5µA

40

135

290

µmho

Error Amp Voltage Gain

135

V/V

Maximum Duty Cycle

78

85

%

Switching Frequency

FSLCT = Ground

480

600

720

kHz

1

1.25

1.5

MHz

Shutdown Pin Current

0.01

0.1

µA

−0.5

-1

Switch Leakage Current

0.01

3

µA

0.2

0.4

Ω

SHDN Threshold

Output High

0.9

0.6

V

Output Low

0.6

0.3

V

UVP

On Threshold

1.8

1.92

2.0

V

Off Threshold

1.7

1.82

1.9

V

Thermal Resistance

235

°C/W

225

220

200

195

(6)

Junction to ambient thermal resistance (no external heat sink) for the VSSOP package with minimal trace widths (0.010 inches) from the

pins to the circuit. See "Scenario 'A'" in the Power Dissipation section.

(7)

Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.0191 sq. in. of copper heat sinking. See "Scenario 'B'" in the Power Dissipation section.

(8)

Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.0465 sq. in. of copper heat sinking. See "Scenario 'C'" in the Power Dissipation section.

(9)

Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.2523 sq. in. of copper heat sinking. See "Scenario 'D'" in the Power Dissipation section.

(10) Junction to ambient thermal resistance for the VSSOP package with minimal trace widths (0.010 inches) from the pins to the circuit and

approximately 0.0098 sq. in. of copper heat sinking on the top layer and 0.0760 sq. in. of copper heat sinking on the bottom layer, with

three 0.020 in. vias connecting the planes. See "Scenario 'E'" in the Power Dissipation section.

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